Enlarge / A sample chiplet design, with the CPU dies made with a more advanced manufacturing process and the chipset and some other functions made on older, cheaper processes. (credit: Universal Chipset Interconnect Express)
Some of the CPU industry’s heaviest hitters—including Intel, AMD, Qualcomm, Arm, TSMC, and Samsung—are banding together to define a new standard for chiplet-based processor designs. Dubbed Universal Chiplet Interconnect Express (UCIe for short), the new standard seeks to define an open, interoperable standard for combining multiple silicon dies (or chiplets) into a single package.
Intel, AMD, and others are already designing or selling chiplet-based processors in some form—most of AMD’s Ryzen CPUs use chiplets, and Intel’s upcoming Sapphire Rapids Xeon processors…